• Digital and analog design flows on TSMC A16™ and N2P deliver optimized performance and rapid analog design migration, enabled by Synopsys.ai
• Early collaboration on TSMC A14 process underway for Synopsys EDA flows development
• Collaboration on 3Dblox and TSMC's CoWoS® technologies for 5.5x reticle size packages, speeds integration of 3D stacked dies in next-generation AI chips
• Broad portfolio of Synopsys Foundation and Interface IP provides the lowest power on TSMC's N2/N2P processes
• Industry's most complete IP solutions for leading-edge standards, including HBM4, 1.6T Ethernet, UCIe, PCIe 7.0, and UALink, enable high-bandwidth interfaces in data-intensive heterogeneous SoCs

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